No Clean Lead Free w/ Silver Solder Paste - 25g Syringe
USD $23.69
MG Chemicals has developed a unique flux system designed specifically for high temperature lead free alloys.
DESCRIPTION
MG Chemicals has developed a unique flux system designed specifically for high temperature lead free alloys.
It provides the fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere (normal). Since use of nitrogen is not required, MG 4900P Lead Free Solder paste will provide excellent cost savings. In addition, MG 4900P Lead Free solder paste exhibits superior joint strength, excellent wettability, and extraordinary print definition and tack life. The post soldering residues of MG 4900P are non-conductive, non-corrosive, and highly insulated.
NOTE: For optimal shelf life, this product should be kept refrigerated (6 months @ 2-10°C; 1 month @ 20-25°C).
- Sn/Ag/Cu alloy
- Low residues
- Easily dispensed
- Long tack-time
- Excellent wettability
- Hard non-conductive residues
RESOURCES & DOWNLOADS
Additional information
| Weight | 0.052 kg |
|---|---|
| Dimensions | 16.80 × 4.10 × 2 cm |
| Type | |
| Chemistry | |
| Diameter | |
| Quantity | |
| Packaging |
REVIEWS
Related products
Solarbotics, Ltd. is not responsible for misprints or errors on product prices or information. For more information, please see our Terms and Conditions.
Warning: This product contains chemicals known to the State of California to cause cancer and birth defects or other reproductive harm.
Please visit www.P65Warnings.ca.gov for more information. This item was manufactured prior to August 31, 2018.